Polymer thermal analysis (DSC/TGA)
Welding Process Qualification Checklist
Comparison of manufacturing conditions
Component construction: cut, dimensions, and plating
Cross-section, 1 plane
Ion chromatography
Basic Course: Introduction to Electronics Failure Analysis
Course: Materials Characterization Techniques
DSC / TGA
Dye & pry (BGA)
Plating thickness and dimensions (via, trace, board)
PCB Evaluation: Plating, Delamination, Resin, Dimensions
New process or process change assessment
FT-IR ATR
ICP, per element
Polymer identification (FT-IR)
External and optical inspection (non-destructive)
Root cause analysis
Weld wetness and IMC thickness (cross-section + SEM)
FA Express Package (inspection, X-ray, 1 cross-section, SEM/EDS, report)
Raman
2D X-rays
2D X-rays with void measurement
SEM surface without EDS
Have an account? Log in to check out faster.
